Allegro V17.2
Allegro Design Entry CIS
Orcad (.dsn) for schematic capture
Cadence Concept for schematic capture
Mentor Graphics
Altium Designer V16
Our design includes consideration of the following
Test Performance
Signal Integrity
Manufacturability of the board
5Ghz and 2.4Ghz Multi site RF
25 Gbps Serdes
0.35mm pitch Direct Probe Octal Site RF
The following Three functions are equally important for high performance load boards.
Board Design
Board manufacturing
Component assembly
ESD Control Area Is ESD S20.20 Certificated.
| PCB Fabrication | |
| Finished Board Size (inches) | 20 X 25 |
| DUT Pitch, Minimum (mm) | 0.35 |
| Layer Count | 60 |
| Board Thickness (mils) | 300 |
| Minimum Inner Thin Core Thickness (mils) | 2 |
| Minimum Inner layer Line Width / Space (mils) | 2 / 2.5 |
| Minimum Outer layer Line Width / Space (mils) | 3.5 / 2.5 |
| Minimum Pad Size (mils) | 4 |
| Maximum Aspect Ratio (Thru-Hole) | 33 : 1 |
| Minimum Laser Drill size (mils) | 2 |
| Gold Thickness(um) | 3 |
| Single-Ended Impedance Control (Coated Microstrip) | +/- 3% |
| Sequential Lamination Cycles | 9 |
| Stacked Microvias | Yes |
| PCB Assembly | |
| Smallest Chip Component Size | 0201 |
| Smallest BGA Pitch (mm) | 0.35 |
| X-Ray Inspection | Yes |
| AOI Inspection | Yes |
| Fly Probe Testing | Yes |
